Discrete design assemblies, integrated microwave assemblies (IMA), PCB assemblies with soldered packaged parts. Single & Multi-Layer circuit design. Bare die chips connected with 1 mil wires.

• Amplifier design: input noise matched LNA, conjugate matched gain blocks, inter-stage matched, output power matched.
• Oscillator circuit design: VCO (voltage controlled oscillator), CRO (coaxial resonator oscillator), DRO (dielectric resonator oscillator).
• Frequency multiplier design: Schottky and step recovery diode.
• Combed Generator design.
• Diode detector circuit design.
• PIN diode switch circuit design.
• PIN diode attenuator circuit design.
• Filter circuit design: Lowpass, bandpass, highpass. Butterworth, Chebyscheff, elliptic. Microstrip & stripline.
• Filter design: Lumped element. Distributed microwave design. Microwave & stripline.
• Analog filter design.
• RF & microwave power combiner & power dividers. Lumped element & distributed design.
• Up/Down frequency converters.
• Cascaded component link analysis.
• AutoCad schematics and circuit layouts, (e.g. top assy, sub-assy).
• Solidworks models and model analysis (e.g. thermal, strength, vibration, flexibility).
• Substrate circuit board design techniques to reduce EMC radiation. Grounding methods, partitioning, capacitive selection for by-passing, de-coupling, trace separation, terminations, interconnections, trace routing, via hole structures, and multi-layer multiple grounding.
• Circuit Layout design: PCB. Substrates, RF & microwave, microwave, stripline, co-planer waveguide, grounded co-planer, and suspended substrate structure design.
• Lead team for new product development.