Discrete design assemblies, integrated microwave assemblies (IMA),
PCB assemblies with soldered packaged parts. Single & Multi-Layer circuit design.
Bare die chips connected with 1 mil wires.
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Amplifier design: input noise matched LNA, conjugate matched gain blocks, inter-stage matched, output power matched.
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Oscillator circuit design: VCO (voltage controlled oscillator), CRO (coaxial resonator oscillator), DRO (dielectric resonator oscillator).
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Frequency multiplier design: Schottky and step recovery diode.
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Combed Generator design.
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Diode detector circuit design.
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PIN diode switch circuit design.
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PIN diode attenuator circuit design.
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Filter circuit design: Lowpass, bandpass, highpass. Butterworth, Chebyscheff, elliptic. Microstrip & stripline.
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Filter design: Lumped element. Distributed microwave design. Microwave & stripline.
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Analog filter design.
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RF & microwave power combiner & power dividers. Lumped element & distributed design.
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Up/Down frequency converters.
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Cascaded component link analysis.
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AutoCad schematics and circuit layouts, (e.g. top assy, sub-assy).
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Solidworks models and model analysis (e.g. thermal, strength, vibration, flexibility).
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Substrate circuit board design techniques to reduce EMC radiation. Grounding methods, partitioning, capacitive selection for by-passing, de-coupling, trace separation, terminations, interconnections, trace routing, via hole structures, and multi-layer multiple grounding.
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Circuit Layout design: PCB. Substrates, RF & microwave, microwave, stripline, co-planer waveguide, grounded co-planer, and suspended substrate structure design.
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Lead team for new product development.